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(M/MC255) Life Cycle Assessment of Lead-Free Soldering in the Electronics Industry. Snowdon, Kenneth1, Tanner, Chris1, Mead, Carl1,2, 1 2 ABSTRACT- Lead based solders are used extensively in the global electronics industry for soldering components to Printed Circuit Boards. (PCBs). In recent years increasing concern has been expressed about the fate of old electronic equipment ending up in landfills with possible contamination of ground water supplies from leaching of this toxic, heavy metal. This concern has prompted draft legislation to be proposed in Europe leading to the banning of leaded solders by 1/1/2008. Such action has prompted many studies world-wide on the development of lead-free solders for electronics assembly. Work in the authors' laboratory commenced over 10 years ago to study the technical, economic and environmental feasibility of lead-free solders. An environmental life cycle assessment of one of the leading candidates- tin-copper solder will be presented in comparison with the standard tin-lead eutectic solder. All life cycle stages from raw material extraction (metal mining), solder production, solder assembly, use phase and end-of-life leachate testing will be compared. The functional unit selected was a working PCB from a Nortel 8009 business telephone. The solder used in its manufacture in various forms, wire ,bar and paste will be described and assessed. Production implications of changing over to the tin-copper solder will be emphasised and environmental implications of changes to the infrastructure and supply chain quantified. Key words: lca, leadfree, soldering, electronics |
